Item项目 | Details项目内容 | Critical工艺能力 | Remark备注 |
Layers层数 | MIN & MAX | 1&4 |
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Production dimensions生产尺寸 | Make up dim.拼版尺寸(max) | 500mm*600mm | Double layer |
Make up dim.拼版尺寸(max) | 500mm*1800mm | Single layer |
Coverlay design覆盖膜设计 | Coverlay window drilling覆盖膜开窗钻孔(min) | Φ0.5mm |
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Coverlay window square window覆盖膜开窗方形开窗口(min) | 0.6*0.6 mm |
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Coverlay window opening distance覆盖膜开窗距离(min) | 0.3mm |
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Coverlay -pad & Circuit-Circuit distance开窗到焊盘&线路距离(min) | 0.2mm |
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Coverlay window tolerance覆盖膜开窗公差 | ±0.1mm |
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Coverlay offset tolerance覆盖膜偏位公差 | ±0.2mm |
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Circuit design线路设计 | Circuit width/distance线宽/线距(min) | 50/50um |
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Gold finger width tolerance金手指宽度公差 | ±0.03mm |
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Gold finger pitch tolerance金手指间距公差 | ±0.03mm |
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Circuit-Board edge distance线路到板边距离(min) | 0.15mm |
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Circuit-Pad distance线路到焊盘距离(min) | 0.3mm |
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Circuit-Hole distance线路到冲孔距离(min) | 0.15mm |
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Shape design 外型设计 | R angle(min)最小R角 | 0.1mm |
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Plug width tolerance FPC外形公差 | ±0.05-0.1mm |
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Gold finger pitch tolerance(with stiffiner) | ±0.05-0.1mm |
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插头总宽公差(补强后) | ±0.05-0.1mm |
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Plug eccentricity tolerance | Φ0.5mm-Φ10mm |
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插头偏心公差(补强后) | ±0.05mm |
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Solder mask & character design防焊字符设计 | Solder mask size 防焊开窗(min) | 0.25mm |
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Printing ink thickness油墨厚度(min & max) | 15-30um |
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Solder mask tolerance防焊公差 | ±0.075-0.1mm |
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Character width字符线宽(min) | 0.1mm |
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Character height字符高度(min) | 0.5mm |
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Character distance字符间距(min) | 0.15mm |
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Character-pad distance符到焊盘距离(min) | 0.3mm |
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Four threading test四线程测试 | FPC empty board test空板测试 | 10MΩ min. |
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ICT Test ICT测试 | DC leakage current耐压:1uA-1000uA |
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DC insulation绝缘:1MΩ-1000MΩ |
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DC testing voltage测试电压:5V-1000V |
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Dimensions FPC板尺寸公差管控 | 0-10mm | ±0.05mm |
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10-50mm | ±0.1mm |
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50-100 | ±0.15mm |
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100-150mm | ±0.2mm |
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>150 mm | ±0.25mm |
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SMT Design设计 | SMT type类型 | QFN:0.35mm |
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BGA:0.35mm |
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CSP:0.4mm |
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SMT angle角度 | 1度 degree |
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SMT Eccentricity偏位 | <10% |
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Dispensing design点胶设计 | UV glue胶 | UV0281-1 |
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VS8117B-2 |
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UV8209-1 |
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Black glue黑胶 | VS3812-1 |
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